Electronic Integration Inc.’s design engineering team provides extensive PCB Design and Layout expertise from a concept to a Finished Product to turn your ideas into PCB design reality. By utilizing our extensive manufacturing knowledge at the design stage, we reduce cycle times – saving you headaches with revision updates, order after order. We streamline our design by incorporating DFM/DFA/DFT guidelines. (Design For Manufacturability, Design for Assembly and Design for Test.) Design rule checks are performed at each stage.

Circuit Schematic: With specifications and input from our customer a schematic is drawn. This detailed diagram shows the electrical implementation of each function of the PCB. Electronic Integration Inc. includes information that is necessary for the proper operation of the circuit. The schematic includes adequate design details, such as pin numbers, names, component values, and ratings. A PCB design is a manufactured version of this schematic.

Component Placement and design:
Component placement is next in the process and determined based on thermal management, function, and electrical noise considerations. Bill Of Material is also generated at the same time. This is the component details. The BOM requires the quantity, reference designators, value(numeric value of ohms, farads, etc.), manufacturer part number, and PCB footprint for each component.

Auto routing:
Routing is also known as “tracking”. Routing connects components on the board. An electrical connection between two or more pads is a “net”.

The Design Rule Check (DRC) ensurs that the board meets all manufacturing standards. A DRC basically checks for correct connectivity of the tracks, and for correct widths and clearances.

Cam File Generation/PCB Documentation:
The PCB documents includes the hardware dimensional drawings, schematic, BOM, layout file, component placement file, assembly drawings and instructions, and Gerber files. Gerber files are the output files of the layout that are used by PCB manufacturers to create the PCB. A complete set of Gerber files includes the following.

  • All copper layers(top, bottom and inners)
  • Silkscreen top and bottom
  • Solder mask top and bottom
  • Paste mask top and bottom
  • Component map (X-Y coordinates)
  • Assembly drawing top and bottom
  • Drill file
  • Drill legend
  • FAB outline (dimensions, special features)
  • Netlist file

The FAB outline should include notches, cutouts, bevels, back-filled vias-in-pad (used for BGA-type IC packages that have an array of pins under the device), blind/buried vias, surface finish and leveling, hole tolerances, layer counts.

Quality Standards IPC-2221, IPC-2222 & IPC-275D

Information needed for quoting

  • Bill of materials
  • Board size
  • Number of layers
  • Turnaround time required
  • Is the board SMT, thru-hole or both?
  • Is the board to be Auto-routed or hand-routed?
  • Will spec sheets be provided?
  • Are there any special routing instructions?
  • Are there any special placement instructions?

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