BGA is an advanced packaging technology in SMT assembly. A Ball Grid Array Integrated Circuit is a surface mount device (SMD) component that possesses no leads. This SMD package employs an array of metal spheres that are made of solder called the solder balls for connections to the PCB (Printed Circuit Board).
For BGA soldering, the solder balls on the package have a very carefully controlled amount of solder, and when heated in the soldering process, the solder melts. Surface tension causes the molten solder to hold the package in the correct alignment with the circuit board, while the solder cools and solidifies
We can help you with your requirements. We are ISO9001-2015 certified. We uphold to IPC standards for both performance(IPC 6012) and acceptability IPC-A-610 class 2 and class 3 for pcbs. We have Certified IPC trainer and solderers, are ROHAS, REACH and conflict material compliant, EPA,FAR and NAFTA, compliant.
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