For rework and modification, we provide refinishing operations or repair of an electronic printed circuit board (PCB) assembly, usually involving desoldering and re-soldering of surface-mounted electronic components (SMD).
Apart from these, we can also provide rework and reballing services for BGAs that are already in use. Our rework and reballing capabilities include BGA removal and replacement, rework of ceramic and plastic BGAs and reballing of MBGAs. Our rework system comprises of:
BGA Rework System for alignment and placement or removal of BGA uBGA, CSP or other surface mount components with repeatable solder reflow profiles.
Placement Accuracy to +/- 0.002″
Board capacity Minimum 2 x 2 inches, maximum 14 x 20″
Remove components upto 1.5″ tall
Component sizes minimum .08″(2.0mm)to maximum 2″(51mm) square.
Handle both grid array and leaded-typed components(BGA, CGA, QFP, LCC, TSOP etc…..)
We have numerous other soldering , desoldering stations as well as component formers.
We can help you with your requirements. We are ISO9001-2015 certified. We uphold to IPC standards for both performance(IPC 6012) and acceptability IPC-A-610 class 2 and class 3 for pcbs. We have Certified IPC trainer and solderers, are ROHAS, REACH and conflict material compliant, EPA,FAR and NAFTA, compliant.
At Electronic Integration Inc, we are committed to providing top-quality electronics and exceptional service to our customers worldwide. Stay ahead with our latest tech innovations.
